Bio-Templated
Materials and Devices

Driven by scaling
requirements and the pursuit of novel material properties,
nanotechnology has advanced rapidly. Given the shortcomings of
man-made tools for precise nanoscale assembly, many
researchers have looked to biology for inspiration. The
natural world uses biomolecules such as peptides and proteins
to expertly direct the assembly of inorganic materials. The
organic-inorganic interface controls assembly on multiple
length scales ranging from nanoscale to microscale depending
on the required function. Researchers have begun to harness
this extraordinary capability to make a variety of devices by
integrating peptides or proteins which are able to bind
technologically significant materials into the structural
proteins of viruses. The approach has allowed the realization
of unique device geometries, as well as the opportunity for
enhanced performance and functionality. Current efforts in our
lab are focused on using biomolecules to synthesize new,
multi-component nanoscale materials to address challenges in
the area of solar power generation, photocatalysis, and gas
sensing.
WidE
BandGap Optical Resonators

Micro- and nano- optical resonators such as
microdisks and photonic crystal cavities, have enabled the
observation of important optical phenomena including modified
spontaneous emission rates, high quality factors, extremely
low modal volumes, directional emission, and low threshold
lasing.
The compact
geometry of these resonators is advantageous for high-density
integration with filters and waveguides into optical circuits.
III-nitride semiconductors
and other wide bandgap materials are used to form active,
short wavelength resonators which emit from ultraviolet to
green.
Our lab is
interested in the design and fabrication of novel micro- and
nano- cavities with emphasis on low threshold and sensing
applications.
Photoelectrochemical and
Etching Processes

Photoelectrochemical
(PEC) etching is a light-induced etching technique which uses
photogenerated minority carriers to facilitate material
dissolution. A semiconductor anode and Pt counter electrode
immersed in an electrolyte solution form an electrochemical
cell which is illuminated with above bandgap light. In the
presence of sufficient photogenerated carriers, etching occurs
at the semiconductor/electrolyte interface. Minority carrier
transport to the semiconductor surface is determined by the
energy band bending at the semiconductor/electrolyte interface
which can be readily engineered by choice of material or
dopant, or through an externally applied bias. Most commonly,
the anode is an n-type semiconductor in which photogenerated
holes at the

semiconductor/electrolyte interface enable dissociation of the
semiconductor through the formation of an oxide which is
soluble in the electrolyte or through direct ionic dissolution
of the semiconductor. PEC etching is a low damage etching
approach which is both material- (dopant and bandgap) and
spatially-selective. Furthermore, it can be used for highly
anisotropic vertical etching in addition to deep lateral
undercut formation. It is a particularly attractive technique
for semiconductor materials such as the III-nitrides in which
conventional electrochemical etchants are relatively
ineffective.

Dry etching
processes such as reactive ion etching (RIE),
inductively-coupled plasma (ICP) etching, and
chemically-assisted ion beam etching (CAIBE) use low energy
ion bombardment to attain anisotropic etch profiles. Low
energy ions can damage semiconductor materials, degrading
device performance. We are interested in studying the range
and effect of ion damage on electrical and optical materials
properties.
Funding